1. Okuziyiza okukulukuta: Ebintu ebisookerwako nga ekikomo n’ekyuma bitera okufuuka omukka mu mpewo. Okusiiga amasannyalaze ku layeri y’ekyuma n’obuziyiza obw’amaanyi obw’okuziyiza okukulukuta (oxidation resistance) kiyinza okutumbula obuziyiza bw’okukulukuta kw’ebikondo.
2. Enhanced Conductivity: Ebintu ebisookerwako nga ekyuma n’ekikomo kya phosphor bitera okuba n’obutambuzi wansi wa 20%, ekibifuula ebitasaana ku low-impedance n-type connectors. N’olwekyo, okusiiga layeri y’ekyuma ekitambuza ennyo-nga zaabu kiyinza okukendeeza ku impedansi yaabwe.
3. Improved Plating Adhesion: Ku byuma ebirina adhesion embi, copper base coat etera okusiigibwa nga tebannaba electroplating okulongoosa adhesion.